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The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

—— Jay

Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

—— Rob

The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

—— Victoria, Australia

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Double Layer PCB

Materiał

FR4 panele z włókna szklanego, aluminiowa płyta, podłoża miedź, żelazo podłoża, PTFE, F4B, F4BM, Kangtai Li, CER-10, Rogers, FPC miękka deska i kilka innych wysokiej precyzji talerzu.

Rzemieślnictwo

Światło miedź, nikiel, złoto, spray cyny; Immersion Złoto, przeciwutleniacz, HASL zanurzenie cyny, itp

Double Layer PCB Leadfree HASL z niebieskim maski lutowniczej

- Leadfree HASL Wykończenie powierzchni niezbędnej do zaspokojenia z RoHS
Materiał -FR-4 o grubości desek 0.25mm-6mm
Masa -Copper: 1/3 uncje, 0.5oz, 1OZ, 2OZ, 3 uncje, 4 uncje, 5oz, 6oz
-3-3mils Szerokości min Track & rozstaw -0.2mm min Rozmiar końcowy otwór
-Certificate: UL, ISO 14001, TS16949 i ROHS
Zarządzanie -FIRMA: ISO9001
-Markets: Europa, Ameryka, Azja, itp.

Podanie

produkty elektroniczne, takie jak

urządzenia peryferyjne, lotniczy, telekomunikacja, motoryzacyjny, medicaldevices, camermas, urządzenia optoelektroniczne, VCD, LCD oraz verious inne comsumer produktów elektronicznych.

Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

Duży Obraz : Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

Szczegóły Produktu:

Place of Origin:	China
Nazwa handlowa:	SYF
Orzecznictwo:	UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS
Model Number:	SYF-276
Material:	FR4
Solder Mask:	Green/Yellow/Red/Black
Quality:	100% E-Test
Service:	PCB, PCBA, OEM, ODM
Surface Finished:	ENIG, HAL, HASL, OSP, Immersion Silver, Immersion Tin

Kontakt

Szczegółowy opis produktu

High Light:

custom circuit boards

custom pc boards

Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

Quick Details

Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
Best service with quick response is always provided for our customers.
All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
BGA,Blind&Buried Vias and Impedence Control is accepted.
Quality guarantee and professional after-sale service.
Gerber file needed.

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	4-Layer
Board Thickness	2.0mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Green
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
PROCESS Engineer	ITEMS Item	PRODUCTION CAPABILITY Manufacturing Capability
Laminate	Type	FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Laminate	Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Production Type	Surface Treatment	HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
	Internal width/spacing	Min: 4/4mil
	Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Dimension	Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
	Drilling Diameter	≧0.25mm
	Hole Diameter Tolerance	±0.05mm
	Hole Position Tolerance	±0.076mm
	Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
PTH+Panel Plating	Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Outer Layer	Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
EING/Flash Gold	Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask	Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	≧120u〞
Gold Finger	Gold Thickness	1～50u〞
Hot Air Level	Tin Thickness	100～300u〞
Routing	Tolerance of Dimension	±0.1mm
	Slot Size	Min:0.4mm
	Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Punching	Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
	Angle	15°30°45°
	Remain Thickness Tolerance	±0.1mm
Beveling	Beveling Dimension	30～300mm
Test	Testing Voltage	250V
Test	Max.Dimension	540×400mm
Impedance Control	Tolerance	±10%
Aspect Ration		12:1
Laser Drilling Size		4mil(0.1mm)
Special Requirements		Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable

Etykietka:

Osoba kontaktowa: Miss. aaa

Tel: 86 755 8546321

Faks: 86-10-66557788-2345